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Journal: Materials, 2023
Volume: 16
Number: 3482
Article:
Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging
Authors:
by
Wan-Chun Chuang, Yi Huang and Po-En Chen
Link:
https://www.mdpi.com/1996-1944/16/9/3482
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