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Journal: Materials, 2023
Volume: 16
Number: 3482

Article: Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging
Authors: by Wan-Chun Chuang, Yi Huang and Po-En Chen
Link: https://www.mdpi.com/1996-1944/16/9/3482

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