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Journal: Materials, 2023
Volume: 16
Number: 3290
Article:
Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling
Authors:
by
Fu-Ling Chang, Yu-Hsin Lin, Han-Tang Hung, Chen-Wei Kao and C. R. Kao
Link:
https://www.mdpi.com/1996-1944/16/9/3290
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