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Journal: Materials, 2023
Volume: 16
Number: 3233
Article:
Measurements and Modelling of Thermally Induced Warpages of DIMM Socket Server PCB Assembly after Solder Reflow Processes
Authors:
by
Ming-Yi Tsai, Yu-Wen Wang, Yen-Jui Lu, Tzu-Min Lu and Shu-Tan Chung
Link:
https://www.mdpi.com/1996-1944/16/8/3233
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