Wang, L.-F.; Li, Z.; Zhou, B.-A.; Duan, Y.-S.; Liu, N.; Zhang, J.-X.
Study on Tungsten Metallization and Interfacial Bonding of Silicon Nitride High-Temperature Co-Fired Ceramic Substrates. Materials 2023, 16, 2937.
https://doi.org/10.3390/ma16072937
AMA Style
Wang L-F, Li Z, Zhou B-A, Duan Y-S, Liu N, Zhang J-X.
Study on Tungsten Metallization and Interfacial Bonding of Silicon Nitride High-Temperature Co-Fired Ceramic Substrates. Materials. 2023; 16(7):2937.
https://doi.org/10.3390/ma16072937
Chicago/Turabian Style
Wang, Ling-Feng, Zhe Li, Bo-An Zhou, Yu-Sen Duan, Ning Liu, and Jing-Xian Zhang.
2023. "Study on Tungsten Metallization and Interfacial Bonding of Silicon Nitride High-Temperature Co-Fired Ceramic Substrates" Materials 16, no. 7: 2937.
https://doi.org/10.3390/ma16072937
APA Style
Wang, L.-F., Li, Z., Zhou, B.-A., Duan, Y.-S., Liu, N., & Zhang, J.-X.
(2023). Study on Tungsten Metallization and Interfacial Bonding of Silicon Nitride High-Temperature Co-Fired Ceramic Substrates. Materials, 16(7), 2937.
https://doi.org/10.3390/ma16072937