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Journal: Materials, 2023
Volume: 16
Number: 7507

Article: Molecular Dynamics Simulation of the Cu3Sn/Cu Interfacial Diffusion Mechanism under Electrothermal Coupling
Authors: by Zhiwei He, Xin Lan, Lezhou Li and Yong Cheng
Link: https://www.mdpi.com/1996-1944/16/24/7507

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