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Journal: Materials, 2023
Volume: 16
Number: 750
750
Article: Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions
Authors: by Minghong Jian, Sa’d Hamasha, Ali Alahmer, Mohammad Hamasha, Xin Wei, Mohamed El Amine Belhadi and Khozima Hamasha
Link: https://www.mdpi.com/1996-1944/16/2/750

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