Article Versions Notes

Ye Z, Wen X, Wan W, Liu F, Bai W, Xu C, Chen H, Gong P, Han G. Precision Grinding Technology of Silicon Carbide (SiC) Ceramics by Longitudinal Torsional Ultrasonic Vibrations. Materials. 2023; 16(16):5572. https://doi.org/10.3390/ma16165572

Ye, Zejiu, Xu Wen, Weiqiang Wan, Fuchu Liu, Wei Bai, Chao Xu, Hui Chen, Pan Gong, and Guangchao Han. 2023. "Precision Grinding Technology of Silicon Carbide (SiC) Ceramics by Longitudinal Torsional Ultrasonic Vibrations" Materials 16, no. 16: 5572. https://doi.org/10.3390/ma16165572

Ye, Z., Wen, X., Wan, W., Liu, F., Bai, W., Xu, C., Chen, H., Gong, P., & Han, G. (2023). Precision Grinding Technology of Silicon Carbide (SiC) Ceramics by Longitudinal Torsional Ultrasonic Vibrations. Materials, 16(16), 5572. https://doi.org/10.3390/ma16165572