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Journal: Materials, 2023
Volume: 16
Number: 5253

Article: Effect of Thermal Aging on the Interfacial Reaction Behavior and Failure Mechanism of Ni-xCu/Sn Soldering Joints under Shear Loading
Authors: by Zhigang Li, Kai Cheng, Jiajun Liu, Yigang He and Yong Xiao
Link: https://www.mdpi.com/1996-1944/16/15/5253

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