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Journal: Materials, 2023
Volume: 16
Number: 5252

Article: Moldflow Simulation and Characterization of Pure Copper Fabricated via Metal Injection Molding
Authors: by Warda Bahanan, Siti Fatimah, Hyunseok Song, Eun Hye Lee, Dong-Ju Kim, Hae Woong Yang, Chang Hoon Woo, Jungho Ryu, I Putu Widiantara and Young Gun Ko
Link: https://www.mdpi.com/1996-1944/16/15/5252

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