Wang, Y.-Y.; Jia, C.; Xu, M.; Kaseem, M.; Tayebi, M.
Microstructural Changes Caused by the Creep Test in ZK60 Alloy Reinforced by SiCp at Intermediate Temperature after KOBO Extrusion and Aging. Materials 2023, 16, 3885.
https://doi.org/10.3390/ma16103885
AMA Style
Wang Y-Y, Jia C, Xu M, Kaseem M, Tayebi M.
Microstructural Changes Caused by the Creep Test in ZK60 Alloy Reinforced by SiCp at Intermediate Temperature after KOBO Extrusion and Aging. Materials. 2023; 16(10):3885.
https://doi.org/10.3390/ma16103885
Chicago/Turabian Style
Wang, Yang-Yang, Chen Jia, Min Xu, Mosab Kaseem, and Morteza Tayebi.
2023. "Microstructural Changes Caused by the Creep Test in ZK60 Alloy Reinforced by SiCp at Intermediate Temperature after KOBO Extrusion and Aging" Materials 16, no. 10: 3885.
https://doi.org/10.3390/ma16103885
APA Style
Wang, Y.-Y., Jia, C., Xu, M., Kaseem, M., & Tayebi, M.
(2023). Microstructural Changes Caused by the Creep Test in ZK60 Alloy Reinforced by SiCp at Intermediate Temperature after KOBO Extrusion and Aging. Materials, 16(10), 3885.
https://doi.org/10.3390/ma16103885