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Journal: Materials, 2022
Volume: 15
Number: 2529
2529
Article: Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting
Authors: by Ying Meng, Runhua Gao, Xinhua Wang, Sen Huang, Ke Wei, Dahai Wang, Fengwen Mu and Xinyu Liu
Link: https://www.mdpi.com/1996-1944/15/7/2529

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