Order Article Reprints

Ong J-J, Chiu W-L, Lee O-H, Chiang C-W, Chang H-H, Wang C-H, Shie K-C, Yang S-C, Tran D-P, Tu K-N, et al. Low-Temperature Cu/SiO₂ Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces. Materials. 2022; 15(5):1888. https://doi.org/10.3390/ma15051888

Ong, Jia-Juen, Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Kai-Cheng Shie, Shih-Chi Yang, Dinh-Phuc Tran, King-Ning Tu, and et al. 2022. "Low-Temperature Cu/SiO₂ Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces" Materials 15, no. 5: 1888. https://doi.org/10.3390/ma15051888

Ong, J.-J., Chiu, W.-L., Lee, O.-H., Chiang, C.-W., Chang, H.-H., Wang, C.-H., Shie, K.-C., Yang, S.-C., Tran, D.-P., Tu, K.-N., & Chen, C. (2022). Low-Temperature Cu/SiO₂ Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces. Materials, 15(5), 1888. https://doi.org/10.3390/ma15051888