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Journal: Materials, 2022
Volume: 15
Number: 937

Article: Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films
Authors: by Po-Fan Lin, Dinh-Phuc Tran, Hung-Che Liu, Yi-Yi Li and Chih Chen
Link: https://www.mdpi.com/1996-1944/15/3/937

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