Lin, P.-F.; Tran, D.-P.; Liu, H.-C.; Li, Y.-Y.; Chen, C.
Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films. Materials 2022, 15, 937.
https://doi.org/10.3390/ma15030937
AMA Style
Lin P-F, Tran D-P, Liu H-C, Li Y-Y, Chen C.
Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films. Materials. 2022; 15(3):937.
https://doi.org/10.3390/ma15030937
Chicago/Turabian Style
Lin, Po-Fan, Dinh-Phuc Tran, Hung-Che Liu, Yi-Yi Li, and Chih Chen.
2022. "Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films" Materials 15, no. 3: 937.
https://doi.org/10.3390/ma15030937
APA Style
Lin, P.-F., Tran, D.-P., Liu, H.-C., Li, Y.-Y., & Chen, C.
(2022). Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films. Materials, 15(3), 937.
https://doi.org/10.3390/ma15030937