Order Article Reprints

Wang J, Wang X, Zhang L, Zhang L, Duan F, Wang F, Zhang W, Wang J, Zhang Z, Hang C, et al. A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging. Materials. 2022; 15(3):914. https://doi.org/10.3390/ma15030914

Wang, Jintao, Xinjie Wang, Lin Zhang, Luobin Zhang, Fangcheng Duan, Fengyi Wang, Weiwei Zhang, Jianqiang Wang, Zheng Zhang, Chunjin Hang, and et al. 2022. "A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging" Materials 15, no. 3: 914. https://doi.org/10.3390/ma15030914

Wang, J., Wang, X., Zhang, L., Zhang, L., Duan, F., Wang, F., Zhang, W., Wang, J., Zhang, Z., Hang, C., & Chen, H. (2022). A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging. Materials, 15(3), 914. https://doi.org/10.3390/ma15030914