Zhu, Y.; Li, Z.; Bi, H.; Shi, Q.; Han, Y.; Zhang, Q.
Cross-Sectional Profile Evolution of Cu-Ti Gradient Films on C17200 Cu by Vacuum Thermal Diffusion. Materials 2022, 15, 8002.
https://doi.org/10.3390/ma15228002
AMA Style
Zhu Y, Li Z, Bi H, Shi Q, Han Y, Zhang Q.
Cross-Sectional Profile Evolution of Cu-Ti Gradient Films on C17200 Cu by Vacuum Thermal Diffusion. Materials. 2022; 15(22):8002.
https://doi.org/10.3390/ma15228002
Chicago/Turabian Style
Zhu, Yandan, Zecheng Li, Hongchao Bi, Qilong Shi, Yujun Han, and Quanli Zhang.
2022. "Cross-Sectional Profile Evolution of Cu-Ti Gradient Films on C17200 Cu by Vacuum Thermal Diffusion" Materials 15, no. 22: 8002.
https://doi.org/10.3390/ma15228002
APA Style
Zhu, Y., Li, Z., Bi, H., Shi, Q., Han, Y., & Zhang, Q.
(2022). Cross-Sectional Profile Evolution of Cu-Ti Gradient Films on C17200 Cu by Vacuum Thermal Diffusion. Materials, 15(22), 8002.
https://doi.org/10.3390/ma15228002