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Journal: Materials, 2022
Volume: 15
Number: 7357
Article:
Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach
Authors:
by
Shih-Hung Wang, Wensyang Hsu, Yan-Yu Liou, Pei-Chen Huang and Chang-Chun Lee
Link:
https://www.mdpi.com/1996-1944/15/20/7357
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