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Journal: MaterialsVolume: 15Number: 7357
Article: Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach
  • Authors:
  • Shih-Hung Wang1,
  • Wensyang Hsu1,* and
  • Yan-Yu Liou2
  • et al.
Link: https://www.mdpi.com/1996-1944/15/20/7357

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