Xia, J.; Yu, J.; Lu, S.; Huang, Q.; Xie, C.; Wang, Z.
Surface Morphology Evolution during Chemical Mechanical Polishing Based on Microscale Material Removal Modeling for Monocrystalline Silicon. Materials 2022, 15, 5641.
https://doi.org/10.3390/ma15165641
AMA Style
Xia J, Yu J, Lu S, Huang Q, Xie C, Wang Z.
Surface Morphology Evolution during Chemical Mechanical Polishing Based on Microscale Material Removal Modeling for Monocrystalline Silicon. Materials. 2022; 15(16):5641.
https://doi.org/10.3390/ma15165641
Chicago/Turabian Style
Xia, Jingjing, Jun Yu, Siwen Lu, Qiushi Huang, Chun Xie, and Zhanshan Wang.
2022. "Surface Morphology Evolution during Chemical Mechanical Polishing Based on Microscale Material Removal Modeling for Monocrystalline Silicon" Materials 15, no. 16: 5641.
https://doi.org/10.3390/ma15165641
APA Style
Xia, J., Yu, J., Lu, S., Huang, Q., Xie, C., & Wang, Z.
(2022). Surface Morphology Evolution during Chemical Mechanical Polishing Based on Microscale Material Removal Modeling for Monocrystalline Silicon. Materials, 15(16), 5641.
https://doi.org/10.3390/ma15165641