Order Article Reprints

Hyun D-E, Jeon J-B, Lee Y-S, Kim Y-N, Kim M, Ko S, Koo S-M, Shin WH, Park C, Lee D-W, et al. Fabrication of Large-Area Mullite–Cordierite Composite Substrates for Semiconductor Probe Cards and Enhancement of Their Reliability. Materials. 2022; 15(12):4283. https://doi.org/10.3390/ma15124283

Hyun, Da-Eun, Jwa-Bin Jeon, Yeon-Sook Lee, Yong-Nam Kim, Minkyung Kim, Seunghoon Ko, Sang-Mo Koo, Weon Ho Shin, Chulhwan Park, Dong-Won Lee, and et al. 2022. "Fabrication of Large-Area Mullite–Cordierite Composite Substrates for Semiconductor Probe Cards and Enhancement of Their Reliability" Materials 15, no. 12: 4283. https://doi.org/10.3390/ma15124283

Hyun, D.-E., Jeon, J.-B., Lee, Y.-S., Kim, Y.-N., Kim, M., Ko, S., Koo, S.-M., Shin, W. H., Park, C., Lee, D.-W., & Oh, J.-M. (2022). Fabrication of Large-Area Mullite–Cordierite Composite Substrates for Semiconductor Probe Cards and Enhancement of Their Reliability. Materials, 15(12), 4283. https://doi.org/10.3390/ma15124283