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Journal: Materials, 2022
Volume: 15
Number: 108
108
Article: The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration
Authors: by Kexin Xu, Xing Fu, Xinjie Wang, Zhiwei Fu, Xiaofeng Yang, Si Chen, Yijun Shi, Yun Huang and Hongtao Chen
Link: https://www.mdpi.com/1996-1944/15/1/108

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