Microstructure Dependence of Effective Thermal Conductivity of EB-PVD TBCs
1
Beijing Key Laboratory for Advanced Functional Material and Thin Film Technology, School of Materials Science and Engineering, Beihang University (BUAA), Beijing 100191, China
2
Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China
*
Authors to whom correspondence should be addressed.
Academic Editor: Maria Isabel Osendi
Materials 2021, 14(8), 1838; https://doi.org/10.3390/ma14081838
Received: 12 March 2021
/
Revised: 30 March 2021
/
Accepted: 31 March 2021
/
Published: 7 April 2021
(This article belongs to the Section Advanced Materials Characterization)
Microstructure dependence of effective thermal conductivity of the coating was investigated to optimize the thermal insulation of columnar structure electron beam physical vapor deposition (EB-PVD coating), considering constraints by mechanical stress. First, a three-dimensional finite element model of multiple columnar structure was established to involve thermal contact resistance across the interfaces between the adjacent columnar structures. Then, the mathematical formula of each structural parameter was derived to demonstrate the numerical outcome and predict the effective thermal conductivity. After that, the heat conduction characteristics of the columnar structured coating was analyzed to reveal the dependence of the effective thermal conductivity of the thermal barrier coatings (TBCs) on its microstructure characteristics, including the column diameter, the thickness of coating, the ratio of the height of fine column to coarse column and the inclination angle of columns. Finally, the influence of each microstructural parameter on the mechanical stress of the TBCs was studied by a mathematic model, and the optimization of the inclination angle was proposed, considering the thermal insulation and mechanical stress of the coating.
View Full-Text
Keywords:
thermal barrier coatings; electron beam physical vapor deposition; thermal conductivity; finite element simulation
▼
Show Figures
Graphical abstract
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited
MDPI and ACS Style
Qiu, S.-Y.; Wu, C.-W.; Huang, C.-G.; Ma, Y.; Guo, H.-B. Microstructure Dependence of Effective Thermal Conductivity of EB-PVD TBCs. Materials 2021, 14, 1838. https://doi.org/10.3390/ma14081838
AMA Style
Qiu S-Y, Wu C-W, Huang C-G, Ma Y, Guo H-B. Microstructure Dependence of Effective Thermal Conductivity of EB-PVD TBCs. Materials. 2021; 14(8):1838. https://doi.org/10.3390/ma14081838
Chicago/Turabian StyleQiu, Shi-Yi, Chen-Wu Wu, Chen-Guang Huang, Yue Ma, and Hong-Bo Guo. 2021. "Microstructure Dependence of Effective Thermal Conductivity of EB-PVD TBCs" Materials 14, no. 8: 1838. https://doi.org/10.3390/ma14081838
Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.
