Hua, W.; Lin, Q.; Qu, B.; Zheng, Y.; Liu, X.; Li, W.; Zhao, X.; Chen, S.; Zhuo, D.
Exceptional Mechanical Properties and Heat Resistance of Photocurable Bismaleimide Ink for 3D Printing. Materials 2021, 14, 1708.
https://doi.org/10.3390/ma14071708
AMA Style
Hua W, Lin Q, Qu B, Zheng Y, Liu X, Li W, Zhao X, Chen S, Zhuo D.
Exceptional Mechanical Properties and Heat Resistance of Photocurable Bismaleimide Ink for 3D Printing. Materials. 2021; 14(7):1708.
https://doi.org/10.3390/ma14071708
Chicago/Turabian Style
Hua, Wenqiang, Qilang Lin, Bo Qu, Yanyu Zheng, Xiaoying Liu, Wenjie Li, Xiaojing Zhao, Shaoyun Chen, and Dongxian Zhuo.
2021. "Exceptional Mechanical Properties and Heat Resistance of Photocurable Bismaleimide Ink for 3D Printing" Materials 14, no. 7: 1708.
https://doi.org/10.3390/ma14071708
APA Style
Hua, W., Lin, Q., Qu, B., Zheng, Y., Liu, X., Li, W., Zhao, X., Chen, S., & Zhuo, D.
(2021). Exceptional Mechanical Properties and Heat Resistance of Photocurable Bismaleimide Ink for 3D Printing. Materials, 14(7), 1708.
https://doi.org/10.3390/ma14071708