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Journal: Materials, 2021
Volume: 14
Number: 6369

Article: Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite
Authors: by Roman Kolenak, Igor Kostolny, Jaromir Drapala, Paulina Babincova and Matej Pasak
Link: https://www.mdpi.com/1996-1944/14/21/6369

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