Kolenak, R.; Kostolny, I.; Drapala, J.; Babincova, P.; Pasak, M.
Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite. Materials 2021, 14, 6369.
https://doi.org/10.3390/ma14216369
AMA Style
Kolenak R, Kostolny I, Drapala J, Babincova P, Pasak M.
Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite. Materials. 2021; 14(21):6369.
https://doi.org/10.3390/ma14216369
Chicago/Turabian Style
Kolenak, Roman, Igor Kostolny, Jaromir Drapala, Paulina Babincova, and Matej Pasak.
2021. "Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite" Materials 14, no. 21: 6369.
https://doi.org/10.3390/ma14216369
APA Style
Kolenak, R., Kostolny, I., Drapala, J., Babincova, P., & Pasak, M.
(2021). Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite. Materials, 14(21), 6369.
https://doi.org/10.3390/ma14216369