Kolenak, R.;                     Kostolny, I.;                     Drapala, J.;                     Babincova, P.;                     Pasak, M.    
        Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite. Materials 2021, 14, 6369.
    https://doi.org/10.3390/ma14216369
    AMA Style
    
                                Kolenak R,                                 Kostolny I,                                 Drapala J,                                 Babincova P,                                 Pasak M.        
                Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite. Materials. 2021; 14(21):6369.
        https://doi.org/10.3390/ma14216369
    
    Chicago/Turabian Style
    
                                Kolenak, Roman,                                 Igor Kostolny,                                 Jaromir Drapala,                                 Paulina Babincova,                                 and Matej Pasak.        
                2021. "Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite" Materials 14, no. 21: 6369.
        https://doi.org/10.3390/ma14216369
    
    APA Style
    
                                Kolenak, R.,                                 Kostolny, I.,                                 Drapala, J.,                                 Babincova, P.,                                 & Pasak, M.        
        
        (2021). Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite. Materials, 14(21), 6369.
        https://doi.org/10.3390/ma14216369