Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure

Dong, Xiaodi; Zheng, Mingsheng; Wan, Baoquan; Liu, Xuejie; Xu, Haiping; Zha, Junwei

doi:10.3390/ma14216266

Open AccessArticle

Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure

by

Xiaodi Dong

¹,

Mingsheng Zheng

^1,*,

Baoquan Wan

¹,

Xuejie Liu

¹,

Haiping Xu

² and

Junwei Zha

^1,2,3,*

¹

School of Chemistry and Biological Engineering, University of Science & Technology Beijing, Beijing 100083, China

²

Shanghai Engineering Research Center of Advanced Thermal Functional Materials, Shanghai Polytechnic University, Shanghai 201209, China

³

Beijing Advanced Innovation Center for Materials Genome Engineering, University of Science & Technology Beijing, Beijing 100083, China

^*

Authors to whom correspondence should be addressed.

Materials 2021, 14(21), 6266; https://doi.org/10.3390/ma14216266

Submission received: 28 September 2021 / Revised: 18 October 2021 / Accepted: 20 October 2021 / Published: 21 October 2021

(This article belongs to the Special Issue Novel Dielectric Materials: Innovations and Applications)

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Abstract

As the miniaturization of electronic appliances and microprocessors progresses, low-permittivity interlayer materials are becoming increasingly important for their suppression of electronic crosstalk, signal propagation delay and loss, and so forth. Herein, a kind of copolyimide (CPI) film with a “fluorene” rigid conjugated structure was prepared successfully. By introducing 9,9-Bis(3-fluoro-4-aminophenyl) fluorene as the rigid conjugated structure monomer, a series of CPI films with different molecular weights were fabricated by in situ polymerization, which not only achieved the reduction of permittivity but also maintained excellent thermodynamic stability. Moreover, the hydrophobicity of the CPI film was also improved with the increasing conjugated structure fraction. The lowest permittivity reached 2.53 at 10⁶ Hz, while the thermal decomposition temperature (T_d5%) was up to 530 °C, and the tensile strength was ≥ 96 MPa. Thus, the CPI films are potential dielectric materials for microelectronic and insulation applications.

Keywords: copolyimide; low permittivity; thermal stability; conjugated structure

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MDPI and ACS Style

Dong, X.; Zheng, M.; Wan, B.; Liu, X.; Xu, H.; Zha, J. Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure. Materials 2021, 14, 6266. https://doi.org/10.3390/ma14216266

AMA Style

Dong X, Zheng M, Wan B, Liu X, Xu H, Zha J. Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure. Materials. 2021; 14(21):6266. https://doi.org/10.3390/ma14216266

Chicago/Turabian Style

Dong, Xiaodi, Mingsheng Zheng, Baoquan Wan, Xuejie Liu, Haiping Xu, and Junwei Zha. 2021. "Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure" Materials 14, no. 21: 6266. https://doi.org/10.3390/ma14216266

APA Style

Dong, X., Zheng, M., Wan, B., Liu, X., Xu, H., & Zha, J. (2021). Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure. Materials, 14(21), 6266. https://doi.org/10.3390/ma14216266

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Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure

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