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Journal: Materials, 2021
Volume: 14
Number: 5973
Article:
Grain-Scale Anisotropic Analysis of Steady-State Creep in Oligocrystalline SAC Solder Joints
Authors:
by
Qian Jiang, Abhishek Nitin Deshpande and Abhijit Dasgupta
Link:
https://www.mdpi.com/1996-1944/14/20/5973
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