Jeong, G.; Yu, D.-Y.; Baek, S.; Bang, J.; Lee, T.-I.; Jung, S.-B.; Kim, J.; Ko, Y.-H.
Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding. Materials 2021, 14, 335.
https://doi.org/10.3390/ma14020335
AMA Style
Jeong G, Yu D-Y, Baek S, Bang J, Lee T-I, Jung S-B, Kim J, Ko Y-H.
Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding. Materials. 2021; 14(2):335.
https://doi.org/10.3390/ma14020335
Chicago/Turabian Style
Jeong, Gyuwon, Dong-Yurl Yu, Seongju Baek, Junghwan Bang, Tae-Ik Lee, Seung-Boo Jung, JungSoo Kim, and Yong-Ho Ko.
2021. "Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding" Materials 14, no. 2: 335.
https://doi.org/10.3390/ma14020335
APA Style
Jeong, G., Yu, D.-Y., Baek, S., Bang, J., Lee, T.-I., Jung, S.-B., Kim, J., & Ko, Y.-H.
(2021). Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding. Materials, 14(2), 335.
https://doi.org/10.3390/ma14020335
