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Ramli MII, Salleh MAAM, Sandu AV, Amli SFM, Said RM, Saud N, Abdullah MMAB, Vizureanu P, Rylski A, Chaiprapa J, et al. Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing. Materials. 2021; 14(18):5134. https://doi.org/10.3390/ma14185134

Ramli, Mohd Izrul Izwan, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Siti Farahnabilah Muhd Amli, Rita Mohd Said, Norainiza Saud, Mohd Mustafa Al Bakri Abdullah, Petrica Vizureanu, Adam Rylski, Jitrin Chaiprapa, and et al. 2021. "Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing" Materials 14, no. 18: 5134. https://doi.org/10.3390/ma14185134

Ramli, M. I. I., Salleh, M. A. A. M., Sandu, A. V., Amli, S. F. M., Said, R. M., Saud, N., Abdullah, M. M. A. B., Vizureanu, P., Rylski, A., Chaiprapa, J., & Nabialek, M. (2021). Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing. Materials, 14(18), 5134. https://doi.org/10.3390/ma14185134