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Journal: Materials, 2021
Volume: 14
Number: 4869

Article: Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper
Authors: by Hongpeng Jiang, Guangqiang Yan, Jianwei Li, Jie Xu, Debin Shan and Bin Guo
Link: https://www.mdpi.com/1996-1944/14/17/4869

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