Hong, N.; Zhang, Y.; Sun, Q.; Fan, W.; Li, M.; Xie, M.; Fu, W.
The Evolution of Organosilicon Precursors for Low-k Interlayer Dielectric Fabrication Driven by Integration Challenges. Materials 2021, 14, 4827.
https://doi.org/10.3390/ma14174827
AMA Style
Hong N, Zhang Y, Sun Q, Fan W, Li M, Xie M, Fu W.
The Evolution of Organosilicon Precursors for Low-k Interlayer Dielectric Fabrication Driven by Integration Challenges. Materials. 2021; 14(17):4827.
https://doi.org/10.3390/ma14174827
Chicago/Turabian Style
Hong, Nianmin, Yinong Zhang, Quan Sun, Wenjie Fan, Menglu Li, Meng Xie, and Wenxin Fu.
2021. "The Evolution of Organosilicon Precursors for Low-k Interlayer Dielectric Fabrication Driven by Integration Challenges" Materials 14, no. 17: 4827.
https://doi.org/10.3390/ma14174827
APA Style
Hong, N., Zhang, Y., Sun, Q., Fan, W., Li, M., Xie, M., & Fu, W.
(2021). The Evolution of Organosilicon Precursors for Low-k Interlayer Dielectric Fabrication Driven by Integration Challenges. Materials, 14(17), 4827.
https://doi.org/10.3390/ma14174827