Wang, X.; Chou, C.-C.; Wu, L.T.-S.; Wu, R.; Lee, J.-W.; Chang, H.-Y.
Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer. Materials 2021, 14, 2571.
https://doi.org/10.3390/ma14102571
AMA Style
Wang X, Chou C-C, Wu LT-S, Wu R, Lee J-W, Chang H-Y.
Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer. Materials. 2021; 14(10):2571.
https://doi.org/10.3390/ma14102571
Chicago/Turabian Style
Wang, Xiaoli, Chau-Chang Chou, Liberty Tse-Shu Wu, Rudder Wu, Jyh-Wei Lee, and Horng-Yi Chang.
2021. "Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer" Materials 14, no. 10: 2571.
https://doi.org/10.3390/ma14102571
APA Style
Wang, X., Chou, C.-C., Wu, L. T.-S., Wu, R., Lee, J.-W., & Chang, H.-Y.
(2021). Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer. Materials, 14(10), 2571.
https://doi.org/10.3390/ma14102571