Next Article in Journal
Microstructure and Properties of Inconel 625 Fabricated Using Two Types of Laser Metal Deposition Methods
Next Article in Special Issue
Phase Diagram of Binary Alloy Nanoparticles under High Pressure
Previous Article in Journal
Statistical Research of Stainless Austenitic Steel Grain Size Distribution after Screw Rolling
Previous Article in Special Issue
Reactive Infiltration and Microstructural Characteristics of Sn-V Active Solder Alloys on Porous Graphite
 
 

Order Article Reprints

Journal: Materials, 2020
Volume: 13
Number: 5049

Article: Recent Advances in Barrier Layer of Cu Interconnects
Authors: by Zhi Li, Ye Tian, Chao Teng and Hai Cao
Link: https://www.mdpi.com/1996-1944/13/21/5049

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop