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Open AccessArticle

Evidence of Stress Development as a Source of Driving Force for Grain-Boundary Migration in a Ni Bicrystalline TEM Specimen

Department of Materials Science and Engineering and Research Institute of Advanced Materials (RIAM), Seoul 08826, Korea
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Materials 2020, 13(2), 360; https://doi.org/10.3390/ma13020360
Received: 16 December 2019 / Revised: 7 January 2020 / Accepted: 10 January 2020 / Published: 12 January 2020
(This article belongs to the Special Issue Structure and Properties of Grain Boundaries in Crystalline Materials)
In a previous study, using high-resolution transmission electron microscopy (HRTEM), we examined grain-boundary migration behavior in a Ni bicrystal. A specimen for transmission electron microscopy (TEM) was prepared using focused ion beam. The Ni lamella in the specimen was composed of two grains with surface normal directions of [1 0 0] and [1 1 0]. As the lamella was heated to 600 °C in a TEM, it was subjected to compressive stresses. The stress state of the Ni lamella approximated to the isostress condition, which was confirmed by a finite element method. However, the stress development was not experimentally confirmed in the previous study. In the present study, we present an observation of stacking faults with a length of 40–70 nm at the grain boundary as direct evidence of the stress development. View Full-Text
Keywords: nickel; transmission electron microscopy (TEM); grain-boundary migration; stress development; stacking fault nickel; transmission electron microscopy (TEM); grain-boundary migration; stress development; stacking fault
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Lee, S.B.; Jung, J.; Han, H.N. Evidence of Stress Development as a Source of Driving Force for Grain-Boundary Migration in a Ni Bicrystalline TEM Specimen. Materials 2020, 13, 360.

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