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Journal: MaterialsVolume: 13Number: 2825
Article: Hot-Deformation Behavior and Microstructure Evolution of the Dual-Scale SiCp/A356 Composites Based on Optimal Hot-Processing Parameters
  • Authors:
  • Yahu Song1,2,
  • Aiqin Wang1,* and
  • Douqin Ma3
  • et al.
Link: https://www.mdpi.com/1996-1944/13/12/2825

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