Fan, J.; Wu, J.; Jiang, C.; Zhang, H.; Ibrahim, M.; Deng, L.
Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints. Materials 2020, 13, 94.
https://doi.org/10.3390/ma13010094
AMA Style
Fan J, Wu J, Jiang C, Zhang H, Ibrahim M, Deng L.
Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints. Materials. 2020; 13(1):94.
https://doi.org/10.3390/ma13010094
Chicago/Turabian Style
Fan, Jiajie, Jie Wu, Changzhen Jiang, Hao Zhang, Mesfin Ibrahim, and Liang Deng.
2020. "Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints" Materials 13, no. 1: 94.
https://doi.org/10.3390/ma13010094
APA Style
Fan, J., Wu, J., Jiang, C., Zhang, H., Ibrahim, M., & Deng, L.
(2020). Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints. Materials, 13(1), 94.
https://doi.org/10.3390/ma13010094