Liu, S.; Li, Y.; Xing, S.; Liu, L.; Zou, G.; Zhang, P.
Structure Inheritance in Nanoparticle Ink Direct-Writing Processes and Crack-Free Nano-Copper Interconnects Printed by a Single-Run Approach. Materials 2019, 12, 1559.
https://doi.org/10.3390/ma12091559
AMA Style
Liu S, Li Y, Xing S, Liu L, Zou G, Zhang P.
Structure Inheritance in Nanoparticle Ink Direct-Writing Processes and Crack-Free Nano-Copper Interconnects Printed by a Single-Run Approach. Materials. 2019; 12(9):1559.
https://doi.org/10.3390/ma12091559
Chicago/Turabian Style
Liu, Shujie, Yujie Li, Songling Xing, Lei Liu, Guisheng Zou, and Peng Zhang.
2019. "Structure Inheritance in Nanoparticle Ink Direct-Writing Processes and Crack-Free Nano-Copper Interconnects Printed by a Single-Run Approach" Materials 12, no. 9: 1559.
https://doi.org/10.3390/ma12091559
APA Style
Liu, S., Li, Y., Xing, S., Liu, L., Zou, G., & Zhang, P.
(2019). Structure Inheritance in Nanoparticle Ink Direct-Writing Processes and Crack-Free Nano-Copper Interconnects Printed by a Single-Run Approach. Materials, 12(9), 1559.
https://doi.org/10.3390/ma12091559