Kim, M.; Choi, H.; Kim, T.; Hong, I.; Roh, Y.; Park, J.; Seo, S.; Han, S.; Koh, J.-s.; Kang, D.
FEP Encapsulated Crack-Based Sensor for Measurement in Moisture-Laden Environment. Materials 2019, 12, 1516.
https://doi.org/10.3390/ma12091516
AMA Style
Kim M, Choi H, Kim T, Hong I, Roh Y, Park J, Seo S, Han S, Koh J-s, Kang D.
FEP Encapsulated Crack-Based Sensor for Measurement in Moisture-Laden Environment. Materials. 2019; 12(9):1516.
https://doi.org/10.3390/ma12091516
Chicago/Turabian Style
Kim, Minho, Hyesu Choi, Taewi Kim, Insic Hong, Yeonwook Roh, Jieun Park, SungChul Seo, Seungyong Han, Je-sung Koh, and Daeshik Kang.
2019. "FEP Encapsulated Crack-Based Sensor for Measurement in Moisture-Laden Environment" Materials 12, no. 9: 1516.
https://doi.org/10.3390/ma12091516
APA Style
Kim, M., Choi, H., Kim, T., Hong, I., Roh, Y., Park, J., Seo, S., Han, S., Koh, J.-s., & Kang, D.
(2019). FEP Encapsulated Crack-Based Sensor for Measurement in Moisture-Laden Environment. Materials, 12(9), 1516.
https://doi.org/10.3390/ma12091516