Thermal Conductivity and High-Frequency Dielectric Properties of Pressureless Sintered SiC-AlN Multiphase Ceramics
State Key Laboratory of Materials-Oriented Chemical Engineering, College of Materials Science and Engineering, Nanjing Tech University, Nanjing 210009, China
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Materials 2018, 11(6), 969; https://doi.org/10.3390/ma11060969
Received: 7 May 2018 / Revised: 1 June 2018 / Accepted: 6 June 2018 / Published: 8 June 2018
SiC-AlN multiphase ceramics with 10 wt. %Y2O3-BaO-SiO2 additives were fabricated by pressureless sintering in a nitrogen atmosphere. The effects of SiC contents and sintering temperatures on the sinterability, microstructure, thermal conductivity and high-frequency dielectric properties were characterized. In addition to 6H-SiC and AlN, the samples also contained Y3Al5O12 and Y4Al2O9. SiC-AlN ceramics sintered with 50 wt. % SiC at 2173 K exhibited the best thermal diffusivity and thermal conductivity (26.21 mm2·s−1 and 61.02 W·m−1·K−1, respectively). The dielectric constant and dielectric loss of the sample sintered with 50 wt. % SiC and 2123 K were 33–37 and 0.4–0.5 at 12.4–18 GHz. The dielectric constant and dielectric loss of the samples decreased as the frequency of electromagnetic waves increased from 12.4–18 GHz. The dielectric thermal conductivity properties of the SiC-AlN samples are discussed.
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MDPI and ACS Style
Gu, J.; Sang, L.; Pan, B.; Feng, Y.; Yang, J.; Li, X. Thermal Conductivity and High-Frequency Dielectric Properties of Pressureless Sintered SiC-AlN Multiphase Ceramics. Materials 2018, 11, 969. https://doi.org/10.3390/ma11060969
AMA Style
Gu J, Sang L, Pan B, Feng Y, Yang J, Li X. Thermal Conductivity and High-Frequency Dielectric Properties of Pressureless Sintered SiC-AlN Multiphase Ceramics. Materials. 2018; 11(6):969. https://doi.org/10.3390/ma11060969
Chicago/Turabian StyleGu, Jialin; Sang, Lingling; Pan, Bo; Feng, Yongbao; Yang, Jian; Li, Xiaoyun. 2018. "Thermal Conductivity and High-Frequency Dielectric Properties of Pressureless Sintered SiC-AlN Multiphase Ceramics" Materials 11, no. 6: 969. https://doi.org/10.3390/ma11060969
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