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Open AccessArticle

RGB-Stack Light Emitting Diode Modules with Transparent Glass Circuit Board and Oil Encapsulation

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Green Technology Research Center, Chang Gung University, Kweishan, Taoyuan 333, Taiwan
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Department of Electronic Engineering, Chang Gung University, Kweishan, Taoyuan 333, Taiwan
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Department of Otolaryngology, Head and Neck Surgery, Chang Gung Memorial Hospital, Kweishan, Taoyuan 333, Taiwan
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Department of Materials Engineering, Ming Chi University of Technology, Taishan, New Taipei City 243, Taiwan
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Department of Urology, Chang Gung Memorial Hospital, Kweishan, Taoyuan 333, Taiwan
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Department of Nephrology, Chang Gung Memorial Hospital, Kweishan, Taoyuan 333, Taiwan
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Department of Physics, University of Central Florida, Orlando, FL 32816, USA
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Department of Opto-Electronic System Engineering, Minghsin University of Science and Technology, Xinfeng Hsinchu 30401, Taiwan
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Author to whom correspondence should be addressed.
Materials 2018, 11(3), 365; https://doi.org/10.3390/ma11030365
Received: 19 December 2017 / Revised: 23 February 2018 / Accepted: 26 February 2018 / Published: 1 March 2018
(This article belongs to the Section Manufacturing Processes and Systems)
The light emitting diode (LED) is widely used in modern solid-state lighting applications, and its output efficiency is closely related to the submounts’ material properties. Most submounts used today, such as low-power printed circuit boards (PCBs) or high-power metal core printed circuit boards (MCPCBs), are not transparent and seriously decrease the output light extraction. To meet the requirements of high light output and better color mixing, a three-dimensional (3-D) stacked flip-chip (FC) LED module is proposed and demonstrated. To realize light penetration and mixing, the mentioned 3-D vertically stacking RGB LEDs use transparent glass as FC package submounts called glass circuit boards (GCB). Light emitted from each GCB stacked LEDs passes through each other and thus exhibits good output efficiency and homogeneous light-mixing characteristics. In this work, the parasitic problem of heat accumulation, which caused by the poor thermal conductivity of GCB and leads to a serious decrease in output efficiency, is solved by a proposed transparent cooling oil encapsulation (OCP) method. View Full-Text
Keywords: FCLED; cooling oil encapsulation; stacking module; transparent glass circuit board FCLED; cooling oil encapsulation; stacking module; transparent glass circuit board
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MDPI and ACS Style

Li, Y.-C.; Chang, Y.-H.; Singh, P.; Chang, L.-B.; Yeh, D.-H.; Chao, T.-Y.; Jian, S.-Y.; Li, Y.-C.; Tan, C.M.; Lai, C.-S.; Chow, L.; Ying, S.-P. RGB-Stack Light Emitting Diode Modules with Transparent Glass Circuit Board and Oil Encapsulation. Materials 2018, 11, 365.

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