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Journal: Materials, 2018
Volume: 11
Number: 319
Article:
Bottom–Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via
Authors:
by
Fu-Long Sun, Zhi-Quan Liu, Cai-Fu Li, Qing-Sheng Zhu, Hao Zhang and Katsuaki Suganuma
Link:
https://www.mdpi.com/1996-1944/11/2/319
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