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Journal: Materials, 2018
Volume: 11
Number: 319

Article: Bottom–Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via
Authors: by Fu-Long Sun, Zhi-Quan Liu, Cai-Fu Li, Qing-Sheng Zhu, Hao Zhang and Katsuaki Suganuma
Link: https://www.mdpi.com/1996-1944/11/2/319

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