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Journal: Materials, 2018
Volume: 11
Number: 239
239
Article: Wafer-Scale Hierarchical Nanopillar Arrays Based on Au Masks and Reactive Ion Etching for Effective 3D SERS Substrate
Authors: by Dandan Men, Yingyi Wu, Chu Wang, Junhuai Xiang, Ganlan Yang, Changjun Wan and Honghua Zhang
Link: https://www.mdpi.com/1996-1944/11/2/239

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