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Journal: Materials, 2018
Volume: 11
Number: 2531
Article:
Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors
Authors:
by
Seungjun Noh, Hao Zhang and Katsuaki Suganuma
Link:
https://www.mdpi.com/1996-1944/11/12/2531
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