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Journal: Materials, 2018
Volume: 11
Number: 2394

Article: Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules
Authors: by Chanyang Choe, Chuantong Chen, Seungjun Noh and Katsuaki Suganuma
Link: https://www.mdpi.com/1996-1944/11/12/2394

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