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Open AccessReview

Materials and Devices for Biodegradable and Soft Biomedical Electronics

School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, Tsinghua University, Beijing 100084, China
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Author to whom correspondence should be addressed.
These authors contributed equally to this work.
Materials 2018, 11(11), 2108; https://doi.org/10.3390/ma11112108
Received: 3 October 2018 / Revised: 22 October 2018 / Accepted: 23 October 2018 / Published: 26 October 2018
Biodegradable and soft biomedical electronics that eliminate secondary surgery and ensure intimate contact with soft biological tissues of the human body are of growing interest, due to their emerging applications in high-quality healthcare monitoring and effective disease treatments. Recent systematic studies have significantly expanded the biodegradable electronic materials database, and various novel transient systems have been proposed. Biodegradable materials with soft properties and integration schemes of flexible or/and stretchable platforms will further advance electronic systems that match the properties of biological systems, providing an important step along the path towards clinical trials. This review focuses on recent progress and achievements in biodegradable and soft electronics for biomedical applications. The available biodegradable materials in their soft formats, the associated novel fabrication schemes, the device layouts, and the functionality of a variety of fully bioresorbable and soft devices, are reviewed. Finally, the key challenges and possible future directions of biodegradable and soft electronics are provided. View Full-Text
Keywords: biodegradable electronics; transient electronics; soft biomedical electronics; biodegradable materials biodegradable electronics; transient electronics; soft biomedical electronics; biodegradable materials
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Li, R.; Wang, L.; Yin, L. Materials and Devices for Biodegradable and Soft Biomedical Electronics. Materials 2018, 11, 2108.

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