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Effect of Sintering Conditions on the Mechanical Strength of Cu-Sintered Joints for High-Power Applications

1
Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH), 156 Gaetbeol-ro, Yeonsu-gu, Incheon 21999, Korea
2
Critical Materials and Semiconductor Packaging Engineering, University of Science and Technology (UST), 217 Gajeong-ro, Yuseong-gu, Daejeon 34113, Korea
*
Author to whom correspondence should be addressed.
Materials 2018, 11(11), 2105; https://doi.org/10.3390/ma11112105
Received: 19 September 2018 / Revised: 23 October 2018 / Accepted: 24 October 2018 / Published: 26 October 2018
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Abstract

In this study, the feasibility of low-cost Cu-sintering technology for power electronics packaging and the effect of sintering conditions on the bonding strength of the Cu-sintered joint have been evaluated. A Cu paste with nano-sized Cu powders and a metal content of ~78% as a high-temperature bonding material was fabricated. The sinter-bonding reactions and mechanical strengths of Cu-sintered joints were evaluated at different sinter bonding pressures, temperatures, and durations during the sintering process. The shear strength of the Cu-sintered joints increased with increasing sintering pressure. Good interfacial uniformity and stable metallurgical microstructures were observed in the Cu joints sintered at a high sintering pressure of 10 MPa, irrespective of the sintering time. It was confirmed that a high-pressure-assisted sintering process could create relatively dense sintered layers and good interfacial uniformity in the Cu-sintered joints, regardless of the sintering temperatures being in the range of 225–300 °C. The influence of the sinter bonding pressure on the shear strengths of the Cu-sintered joints was more significant compared to that of the sintering temperature. Durations of 10 min (at 300 °C) and 60 min (at 225 and 250 °C) are sufficient for complete sintering reactions between the Si chip and the direct bond copper (DBC) substrate. Relatively good metallic bonding and dense sintered microstructures created by a high sintering pressure of 10 MPa resulted in high shear strength in excess of 40 MPa of the Cu-sintered joints. View Full-Text
Keywords: Cu paste sintering; Cu nano powder; power electronics; sinter-bonding; shear strength Cu paste sintering; Cu nano powder; power electronics; sinter-bonding; shear strength
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Yoon, J.-W.; Back, J.-H. Effect of Sintering Conditions on the Mechanical Strength of Cu-Sintered Joints for High-Power Applications. Materials 2018, 11, 2105.

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