Carrier Multiplication Mechanisms and Competing Processes in Colloidal Semiconductor Nanostructures
Abstract
1. Introduction
2. CM Quantum Yield Measurements
3. Carrier Cooling and CM Efficiency
4. CM Mechanisms
5. Engineering Nanostructures to Influence the CM/Cooling Competition
5.1. Size Effects
5.2. Shape and Dimensionality Effects
5.3. Heterostructures
5.4. Surface Effects
5.5. Doping/Photodoping Effects
5.6. Alloy Composition Effects
6. Conclusions and Outlook
Acknowledgments
Author Contributions
Conflicts of Interest
References
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Kershaw, S.V.; Rogach, A.L. Carrier Multiplication Mechanisms and Competing Processes in Colloidal Semiconductor Nanostructures. Materials 2017, 10, 1095. https://doi.org/10.3390/ma10091095
Kershaw SV, Rogach AL. Carrier Multiplication Mechanisms and Competing Processes in Colloidal Semiconductor Nanostructures. Materials. 2017; 10(9):1095. https://doi.org/10.3390/ma10091095
Chicago/Turabian StyleKershaw, Stephen V., and Andrey L. Rogach. 2017. "Carrier Multiplication Mechanisms and Competing Processes in Colloidal Semiconductor Nanostructures" Materials 10, no. 9: 1095. https://doi.org/10.3390/ma10091095
APA StyleKershaw, S. V., & Rogach, A. L. (2017). Carrier Multiplication Mechanisms and Competing Processes in Colloidal Semiconductor Nanostructures. Materials, 10(9), 1095. https://doi.org/10.3390/ma10091095
