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Journal: Materials, 2017
Volume: 10
Number: 739

Article: Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications
Authors: by Muhammad Zain-ul-abdein, Hassan Ijaz, Waqas Saleem, Kabeer Raza, Abdullah Salmeen Bin Mahfouz and Tarek Mabrouki
Link: https://www.mdpi.com/1996-1944/10/7/739

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