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Journal: Materials, 2017
Volume: 10
Number: 323

Article: Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes
Authors: by Giuseppe Schiavone, Jeremy Murray, Richard Perry, Andrew R. Mount, Marc P. Y. Desmulliez and Anthony J. Walton
Link: https://www.mdpi.com/1996-1944/10/3/323

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