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Article

Transient Temperature Rise and Grounding Characteristics of Vertical DC Grounding Electrodes Considering Soil Electro-Thermal Coupling

College of Electrical Engineering and New Energy, China Three Gorges University, Yichang 443002, China
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Author to whom correspondence should be addressed.
Energies 2026, 19(8), 1863; https://doi.org/10.3390/en19081863
Submission received: 12 March 2026 / Revised: 2 April 2026 / Accepted: 7 April 2026 / Published: 10 April 2026
(This article belongs to the Section F: Electrical Engineering)

Abstract

The continuous current dissipation of direct current grounding electrodes generates intense Joule heat, causing severe soil moisture loss and localized thermal runaway. Traditional static models ignore the temperature-dependent nature of soil parameters, leading to dangerous underestimations of actual temperature rises and thermal risks. To address this critical issue, this study establishes a bidirectional dynamic electro-thermal coupled model for a vertical grounding electrode using COMSOL Multiphysics. Comparative analysis demonstrates that the dynamic model accurately reproduces the late-stage accelerated temperature rise observed in experiments, proving its necessity over static methods. Simulations reveal that increased soil resistivity governs heat generation and directly causes a dramatic surge in both grounding resistance and maximum step voltage. In two-layer heterogeneous soils, current is forced into lower-resistivity regions, triggering extreme localized overheating. To mitigate this, expanding the cross-sectional radius of the coke bed effectively suppresses the thermal concentration. These findings provide quantitative evidence and non-uniform design guidelines for the safe operation and thermal protection of grounding electrodes under complex geological conditions.
Keywords: direct current (DC) transmission; vertical grounding electrode; electro-thermal coupling; finite element method; transient temperature rise; grounding performance direct current (DC) transmission; vertical grounding electrode; electro-thermal coupling; finite element method; transient temperature rise; grounding performance

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MDPI and ACS Style

Deng, C.; Fan, Z.; Li, W. Transient Temperature Rise and Grounding Characteristics of Vertical DC Grounding Electrodes Considering Soil Electro-Thermal Coupling. Energies 2026, 19, 1863. https://doi.org/10.3390/en19081863

AMA Style

Deng C, Fan Z, Li W. Transient Temperature Rise and Grounding Characteristics of Vertical DC Grounding Electrodes Considering Soil Electro-Thermal Coupling. Energies. 2026; 19(8):1863. https://doi.org/10.3390/en19081863

Chicago/Turabian Style

Deng, Changzheng, Zechuan Fan, and Weiyi Li. 2026. "Transient Temperature Rise and Grounding Characteristics of Vertical DC Grounding Electrodes Considering Soil Electro-Thermal Coupling" Energies 19, no. 8: 1863. https://doi.org/10.3390/en19081863

APA Style

Deng, C., Fan, Z., & Li, W. (2026). Transient Temperature Rise and Grounding Characteristics of Vertical DC Grounding Electrodes Considering Soil Electro-Thermal Coupling. Energies, 19(8), 1863. https://doi.org/10.3390/en19081863

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