Chen, A.; Chai, J.; Ren, X.; Li, M.; Yu, H.; Wang, G.
A Novel Prediction Model for Thermal Conductivity of Open Microporous Metal Foam Based on Resonance Enhancement Mechanisms. Energies 2025, 18, 1529.
https://doi.org/10.3390/en18061529
AMA Style
Chen A, Chai J, Ren X, Li M, Yu H, Wang G.
A Novel Prediction Model for Thermal Conductivity of Open Microporous Metal Foam Based on Resonance Enhancement Mechanisms. Energies. 2025; 18(6):1529.
https://doi.org/10.3390/en18061529
Chicago/Turabian Style
Chen, Anqi, Jialong Chai, Xiaohan Ren, Mingdong Li, Haiyan Yu, and Guilong Wang.
2025. "A Novel Prediction Model for Thermal Conductivity of Open Microporous Metal Foam Based on Resonance Enhancement Mechanisms" Energies 18, no. 6: 1529.
https://doi.org/10.3390/en18061529
APA Style
Chen, A., Chai, J., Ren, X., Li, M., Yu, H., & Wang, G.
(2025). A Novel Prediction Model for Thermal Conductivity of Open Microporous Metal Foam Based on Resonance Enhancement Mechanisms. Energies, 18(6), 1529.
https://doi.org/10.3390/en18061529